(footprint "TE_PUCK" (version 20231007) (generator pcbnew)
  (layer "F.Cu")
  (property "Reference" "REF**" (at 0 -0.635 0 unlocked) (layer "F.SilkS") (tstamp 4393cebb-c403-4f66-bf01-973a917feec0)
    (effects (font (size 0.46736 0.46736) (thickness 0.04064)))
  )
  (property "Value" "TE_PUCK" (at 0 1.27 0 unlocked) (layer "F.Fab") (tstamp ecd173a3-48b5-458c-8d39-d42841019c98)
    (effects (font (size 0.46736 0.46736) (thickness 0.04064)))
  )
  (property "Footprint" "" (at 0 0 0 unlocked) (layer "F.Fab") hide (tstamp 438a37dc-c701-4b5a-b871-67d35965a6c9)
    (effects (font (size 1.27 1.27)))
  )
  (property "Datasheet" "" (at 0 0 0 unlocked) (layer "F.Fab") hide (tstamp a39ffb6a-2339-414b-9c86-8c3c21352efc)
    (effects (font (size 1.27 1.27)))
  )
  (property "Description" "" (at 0 0 0 unlocked) (layer "F.Fab") hide (tstamp 3c1c287c-539b-4076-986b-74a76290c9df)
    (effects (font (size 1.27 1.27)))
  )
  (fp_arc (start -5.8 -5.5) (mid 0 -8.016135) (end 5.8 -5.499999)
    (stroke (width 0.2032) (type solid)) (layer "F.SilkS") (tstamp afc1f931-a17e-424c-9877-262cd7ba9742))
  (fp_arc (start -2.9 7.4) (mid -7.213827 3.497048) (end -7.699999 -2.300001)
    (stroke (width 0.2032) (type solid)) (layer "F.SilkS") (tstamp 4bbfcbb1-9162-4980-a4e7-0c25f60bc2d3))
  (fp_arc (start 7.7 -2.3) (mid 7.260714 3.47581) (end 2.999999 7.399999)
    (stroke (width 0.2032) (type solid)) (layer "F.SilkS") (tstamp 68929a86-df7b-4a99-a63f-ba703c1292b0))
  (fp_circle (center 0 0) (end 14 0)
    (stroke (width 0.05) (type solid)) (fill none) (layer "F.CrtYd") (tstamp 0d1b3f82-427f-4398-a060-3cc8c501f760))
  (fp_circle (center 0 0) (end 8 0)
    (stroke (width 0.05) (type solid)) (fill none) (layer "F.Fab") (tstamp 9a03dae9-dac1-4088-9a89-61f7e12ba2dd))
  (pad "1" smd rect (at -1.2 7.03) (size 2.4 2.4) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.1016) (thermal_bridge_angle 0)
    (tstamp 4406b4bf-80b7-4284-94d8-9d62eb6326cd)
  )
  (pad "2" smd rect (at -6.4432 -3.72 60) (size 2.5 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.1016) (thermal_bridge_angle 0)
    (tstamp a48d335f-0579-46c5-9395-8029ba4bbdd0)
  )
  (pad "3" smd rect (at 6.4432 -3.72 300) (size 2.5 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.1016) (thermal_bridge_angle 0)
    (tstamp 651e07aa-642e-4e28-ba59-f319a5c6d648)
  )
  (pad "S" smd rect (at 1.75 7.28) (size 1.4 1.74) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.1016) (thermal_bridge_angle 0)
    (tstamp 73432094-a50a-49a5-b2ba-aacf00afced1)
  )
)
